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<dc:creator>López Martín, Pedro</dc:creator>
<dc:creator>Aboy Cebrián, María</dc:creator>
<dc:creator>Muñoz, I.</dc:creator>
<dc:creator>Santos Tejido, Iván</dc:creator>
<dc:creator>Marqués Cuesta, Luis Alberto</dc:creator>
<dc:creator>Couso, Carlos</dc:creator>
<dc:creator>Ullán, Miguel</dc:creator>
<dc:creator>Pelaz Montes, María Lourdes</dc:creator>
<dc:date>2019</dc:date>
<dc:description>Producción Científica</dc:description>
<dc:description>Electronic devices operating in harsh radiation environments must withstand high radiation levels with minimal performance degradation. Recent experiments on the radiation hardness of a new vertical p-type JFET power switch have shown a significant reduction of forward drain current under non-ionizing conditions. In this work, atomistic simulations are used to study the impact of irradiation-induced displacement damage on forward characteristics. Damage models have been updated to produce a better description of damage-dopant interactions at RT. Our results show that excess self-interstitials produced by irradiation deactivate a significant amount of B atoms, thus reducing the effective dopant concentration.</dc:description>
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<dc:language>eng</dc:language>
<dc:publisher>Institute of Electrical and Electronics Engineers (IEEE).</dc:publisher>
<dc:title>IONDegradation in Si Devices in Harsh Radiation Environments: Modeling of Damage-Dopant Interactions</dc:title>
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