<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-04-28T20:56:20Z</responseDate><request verb="GetRecord" identifier="oai:uvadoc.uva.es:10324/59092" metadataPrefix="dim">https://uvadoc.uva.es/oai/request</request><GetRecord><record><header><identifier>oai:uvadoc.uva.es:10324/59092</identifier><datestamp>2025-01-21T11:00:35Z</datestamp><setSpec>com_10324_43510</setSpec><setSpec>com_10324_954</setSpec><setSpec>com_10324_894</setSpec><setSpec>com_10324_1148</setSpec><setSpec>com_10324_931</setSpec><setSpec>col_10324_43513</setSpec><setSpec>col_10324_1270</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:doc="http://www.lyncode.com/xoai" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="93750612bc979894" confidence="600" orcid_id="0000-0003-1329-8806">García García, Héctor</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="c53e2081-cac3-4e5e-b4b2-5db5f7e671a3" confidence="600" orcid_id="">Boo Alvarez, Jonathan</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="cfdc0c1b080da6b8" confidence="600" orcid_id="0000-0003-0389-3409">Vinuesa Sanz, Guillermo</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="81051a2cf33e203e" confidence="600" orcid_id="">González Ossorio, Óscar</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="b3ac8f1769f4dc5a" confidence="600" orcid_id="0000-0002-3380-3403">Sahelices Fernández, Benjamín</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="63f5c1167ffd429a" confidence="600" orcid_id="0000-0002-2328-1752">Dueñas Carazo, Salvador</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="4cef05d647825969" confidence="600" orcid_id="0000-0002-3874-721X">Castán Lanaspa, María Helena</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="9a025c41-6152-4fed-9773-dd56c1af8da8" confidence="600" orcid_id="">Bargalló González, Mireia</dim:field>
<dim:field mdschema="dc" element="contributor" qualifier="author" authority="c425b127-ea76-49d1-b4ee-2908eae16e93" confidence="600" orcid_id="">Campabadal Segura, Francesca</dim:field>
<dim:field mdschema="dc" element="date" qualifier="accessioned">2023-04-12T12:07:19Z</dim:field>
<dim:field mdschema="dc" element="date" qualifier="available">2023-04-12T12:07:19Z</dim:field>
<dim:field mdschema="dc" element="date" qualifier="issued">2021</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="citation" lang="es">Electronics, 2021, Vol. 10, Nº. 22, 2816</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="issn" lang="es">2079-9292</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="uri">https://uvadoc.uva.es/handle/10324/59092</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="doi" lang="es">10.3390/electronics10222816</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="publicationfirstpage" lang="es">2816</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="publicationissue" lang="es">22</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="publicationtitle" lang="es">Electronics</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="publicationvolume" lang="es">10</dim:field>
<dim:field mdschema="dc" element="identifier" qualifier="essn" lang="es">2079-9292</dim:field>
<dim:field mdschema="dc" element="description" lang="es">Producción Científica</dim:field>
<dim:field mdschema="dc" element="description" qualifier="abstract" lang="es">In the attempt to understand the behavior of HfO2-based resistive switching devices at low temperatures, TiN/Ti/HfO2/W metal–insulator–metal devices were fabricated; the atomic layer deposition technique was used to grow the high-k layer. After performing an electroforming process at room temperature, the device was cooled in a cryostat to carry out 100 current–voltage cycles at several temperatures ranging from the “liquid nitrogen temperature” to 350 K. The measurements showed a semiconducting behavior in high and low resistance states. In the low resistance state, a hopping conduction mechanism was obtained. The set and reset voltages increased when temperature decreased because the thermal energies for oxygen vacancies and ions were reduced. However, the temperature did not influence the power absorbed in the reset transition, indicating the local temperature in the filament controls the transition. The set transition turned from gradual to abrupt when decreasing the temperature, due to a positive feedback between the current increase and the Joule heating at low temperatures.</dim:field>
<dim:field mdschema="dc" element="description" qualifier="project" lang="es">Ministerio de Economía, Industria y Competitividad - Fondo Europeo de Desarrollo Regional (Projects  TEC2017-84321-C4-2-R and TEC2017-84321-C4-1-R)</dim:field>
<dim:field mdschema="dc" element="format" qualifier="mimetype" lang="es">application/pdf</dim:field>
<dim:field mdschema="dc" element="language" qualifier="iso" lang="es">eng</dim:field>
<dim:field mdschema="dc" element="publisher" lang="es">MDPI</dim:field>
<dim:field mdschema="dc" element="rights" qualifier="accessRights" lang="es">info:eu-repo/semantics/openAccess</dim:field>
<dim:field mdschema="dc" element="rights" qualifier="uri" lang="*">http://creativecommons.org/licenses/by/4.0/</dim:field>
<dim:field mdschema="dc" element="rights" qualifier="holder" lang="es">© 2021 The authors</dim:field>
<dim:field mdschema="dc" element="rights" lang="*">Atribución 4.0 Internacional</dim:field>
<dim:field mdschema="dc" element="subject" lang="es">Electric resistors</dim:field>
<dim:field mdschema="dc" element="subject" lang="es">Switching circuits</dim:field>
<dim:field mdschema="dc" element="subject" lang="es">Electronic Circuits and Devices</dim:field>
<dim:field mdschema="dc" element="subject" qualifier="classification" lang="es">Resistive switching</dim:field>
<dim:field mdschema="dc" element="subject" qualifier="classification" lang="es">ReRAM devices</dim:field>
<dim:field mdschema="dc" element="subject" qualifier="classification" lang="es">Neuromorphic computing</dim:field>
<dim:field mdschema="dc" element="subject" qualifier="classification" lang="es">Conduction mechanisms</dim:field>
<dim:field mdschema="dc" element="subject" qualifier="unesco" lang="es">2202.03 Electricidad</dim:field>
<dim:field mdschema="dc" element="title" lang="es">Influences of the temperature on the electrical properties of HfO2-based resistive switching devices</dim:field>
<dim:field mdschema="dc" element="type" lang="es">info:eu-repo/semantics/article</dim:field>
<dim:field mdschema="dc" element="type" qualifier="hasVersion" lang="es">info:eu-repo/semantics/publishedVersion</dim:field>
<dim:field mdschema="dc" element="relation" qualifier="publisherversion" lang="es">https://www.mdpi.com/2079-9292/10/22/2816</dim:field>
<dim:field mdschema="dc" element="peerreviewed" lang="es">SI</dim:field>
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