TY  - JOUR 
AU  - Tsai, Chinhao
AU  - Aboy Cebrián, María
AU  - Pelaz Montes, María Lourdes
AU  - Hsu, Yu-Hsiang
AU  - Woon, Wei-Yen
AU  - Timans, Paul J.
AU  - Lee, Chih-Kung
PY  - 2022
SN  - 1369-8001
UR  - https://uvadoc.uva.es/handle/10324/55159
AB  - Intra-die device variation due to pattern layout effects associated with the development of ultra-fast annealing processes is one of the major scaling challenges for advanced CMOS devices. In this paper, we show that an excellent and universal...
LA  - eng
PB  - Elsevier
KW  - Thermal processes
KW  - Procesos termales
TI  - Rapid thermal process driven intra-die device variations
DO  - 10.1016/j.mssp.2022.107052
ER  -