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    Por favor, use este identificador para citar o enlazar este ítem:http://uvadoc.uva.es/handle/10324/28616

    Título
    Modeling and experimental characterization of stepped and v-shaped {311} defects in silicon
    Autor
    Marqués Cuesta, Luis AlbertoAutoridad UVA Orcid
    Aboy Cebrián, MaríaAutoridad UVA Orcid
    Dudeck, Karleen J.
    Botton, Gianluigi A.
    Knights, Andrew P.
    Gwilliam, Russell M.
    Año del Documento
    2014
    Editorial
    AIP Publishing
    Descripción
    Producción Científica
    Documento Fuente
    Journal of Applied Physics, 2014, 115, p. 143514
    Résumé
    We propose an atomistic model to describe extended {311} defects in silicon. It is based on the combination of interstitial and bond defect chains. The model is able to accurately reproduce not only planar {311} defects but also defect structures that show steps, bends, or both. We use molecular dynamics techniques to show that these interstitial and bond defect chains spontaneously transform into extended {311} defects. Simulations are validated by comparing with precise experimental measurements on actual {311} defects. The excellent agreement between the simulated and experimentally derived structures, regarding individual atomic positions and shape of the distinct structural {311} defect units, provides strong evidence for the robustness of the proposed model.
    Palabras Clave
    Atomistic model
    Silicon
    Silicio
    ISSN
    0021-8979
    Revisión por pares
    SI
    DOI
    10.1063/1.4871538
    Patrocinador
    Ministerio de Ciencia e Innovación (Proyect TEC2011-27701)
    Version del Editor
    http://aip.scitation.org/doi/full/10.1063/1.4871538
    Idioma
    eng
    URI
    http://uvadoc.uva.es/handle/10324/28616
    Derechos
    openAccess
    Aparece en las colecciones
    • DEP22 - Artículos de revista [65]
    • Electrónica - Artículos de revista [33]
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    Modeling-experimental-characterization-stepped.pdf
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    Attribution-NonCommercial-NoDerivatives 4.0 InternationalExcepté là où spécifié autrement, la license de ce document est décrite en tant que Attribution-NonCommercial-NoDerivatives 4.0 International

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