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    Por favor, use este identificador para citar o enlazar este ítem:http://uvadoc.uva.es/handle/10324/28620

    Título
    Modeling of defects, dopant diffusion and clustering in silicon
    Autor
    Aboy Cebrián, MaríaAutoridad UVA Orcid
    Santos Tejido, IvánAutoridad UVA Orcid
    Pelaz Montes, María LourdesAutoridad UVA Orcid
    Marqués Cuesta, Luis AlbertoAutoridad UVA Orcid
    López Martín, PedroAutoridad UVA Orcid
    Año del Documento
    2014
    Editorial
    Springer Verlag
    Descripción
    Producción Científica
    Documento Fuente
    Journal of Computational Electronics, 2014, Volume 13, Issue 1, pp 40–58
    Resumo
    Ion implantation is a very well established technique to introduce dopants in semiconductors. This technique has been traditionally used for junction formation in integrated circuit processing, and recently also in solar cells fabrication. In any case, ion implantation causes damage in the silicon lattice that has adverse effects on the performance of devices and the efficiency of solar cells. Alternatively, damage may also have beneficial applications as some studies suggest that small defects may be optically active. Therefore it is important an accurate characterization of defect structures formed upon irradiation. Furthermore, the technological evolution of electronic devices towards the nanometer scale has driven the need for the formation of ultra-shallow and low-resistive junctions. Ion implantation and thermal anneal models are required to predict dopants placement and electrical activation. In this article, we review the main models involved in process simulation, including ion implantation, evolution of point and extended defects and dopant-defect interactions. We identify different regimes at which each type of defect is more relevant and its inclusion in the models becomes crucial. We illustrate in some examples the use of atomistic modeling techniques to gain insight into the physics involved in the processes as well as the relevance of the accuracy of models.
    Palabras Clave
    Silicon
    ISSN
    1569-8025
    Revisión por pares
    SI
    DOI
    10.1007/s10825-013-0512-5
    Patrocinador
    Ministerio de Ciencia e Innovación (Proyect TEC2011-27701)
    Version del Editor
    https://link.springer.com/article/10.1007/s10825-013-0512-5
    Idioma
    eng
    URI
    http://uvadoc.uva.es/handle/10324/28620
    Derechos
    openAccess
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    • DEP22 - Artículos de revista [65]
    • Electrónica - Artículos de revista [33]
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    Attribution-NonCommercial-NoDerivatives 4.0 InternationalExceto quando indicado o contrário, a licença deste item é descrito como Attribution-NonCommercial-NoDerivatives 4.0 International

    Universidad de Valladolid

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