• español
  • English
  • français
  • Deutsch
  • português (Brasil)
  • italiano
    • español
    • English
    • français
    • Deutsch
    • português (Brasil)
    • italiano
    • español
    • English
    • français
    • Deutsch
    • português (Brasil)
    • italiano
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Listar

    Todo UVaDOCComunidadesPor fecha de publicaciónAutoresMateriasTítulos

    Mi cuenta

    Acceder

    Estadísticas

    Ver Estadísticas de uso

    Compartir

    Ver ítem 
    •   UVaDOC Principal
    • PRODUCCIÓN CIENTÍFICA
    • Departamentos
    • Dpto. Teoría de la Señal y Comunicaciones e Ingeniería Telemática
    • DEP71 - Comunicaciones a congresos, conferencias, etc.
    • Ver ítem
    •   UVaDOC Principal
    • PRODUCCIÓN CIENTÍFICA
    • Departamentos
    • Dpto. Teoría de la Señal y Comunicaciones e Ingeniería Telemática
    • DEP71 - Comunicaciones a congresos, conferencias, etc.
    • Ver ítem
    • español
    • English
    • français
    • Deutsch
    • português (Brasil)
    • italiano

    Exportar

    RISMendeleyRefworksZotero
    • edm
    • marc
    • xoai
    • qdc
    • ore
    • ese
    • dim
    • uketd_dc
    • oai_dc
    • etdms
    • rdf
    • mods
    • mets
    • didl
    • premis

    Citas

    Por favor, use este identificador para citar o enlazar este ítem:http://uvadoc.uva.es/handle/10324/25818

    Título
    Could an array of MEMS microphones be used to monitor machinery condition or diagnose failures?
    Autor
    Val Puente, Lara delAutoridad UVA Orcid
    Herráez Sánchez, MartaAutoridad UVA
    Izquierdo Fuente, AlbertoAutoridad UVA Orcid
    Villacorta Calvo, Juan JoséAutoridad UVA Orcid
    Suarez Vivar, Luis
    Congreso
    International Congress on Sound and Vibration (ICSV 24)
    Año del Documento
    2017
    Descripción Física
    8 p
    Descripción
    Producción Científica
    Documento Fuente
    Londres (Reino Unido), 23-27July 2017
    Resumen
    During the last decades, vibration analysis has been used to evaluate condition monitoring and fault diagnosis of complex mechanical systems. The problem associated with these analysis methods is that the employed sensors must be in contact with the vibrant surfaces. To avoid this problem, the current trend is the analysis of the noise, or the acoustic signals, which are directly related with the vibrations, to evaluate condition monitoring and/or fault diagnosis of mechani-cal systems. Both, acoustic and vibration signals, obtained from a system can reveal information related with its operation conditions. Using arrays formed by digital MEMS microphones, which employ acquisition/processing systems based on FPGA, allows creating systems with a high number of sensors paying a reduced cost. This work studies the feasibility of the use of acoustic images, obtained by an array with 64 MEMS microphones (8x8) in a hemianechoic chamber, to detect, characterize and, eventually, identify failure conditions in machinery. The resolution obtained to spatially identify the problem origin in the machine under test. The acous-tic images are processed to extract different feature patterns to identify and classify machinery failures.
    Palabras Clave
    MEMS microphone array
    Fault diagnosis
    Patrocinador
    MINECO/FEDER, UE TEC 2015-68170-R
    Idioma
    eng
    URI
    http://uvadoc.uva.es/handle/10324/25818
    Derechos
    openAccess
    Aparece en las colecciones
    • DEP71 - Comunicaciones a congresos, conferencias, etc. [120]
    Mostrar el registro completo del ítem
    Ficheros en el ítem
    Nombre:
    ICSV24_article1191.pdf
    Tamaño:
    807.7Kb
    Formato:
    Adobe PDF
    Thumbnail
    Visualizar/Abrir
    Attribution-NonCommercial-NoDerivatives 4.0 InternationalLa licencia del ítem se describe como Attribution-NonCommercial-NoDerivatives 4.0 International

    Universidad de Valladolid

    Powered by MIT's. DSpace software, Version 5.10