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dc.contributor.authorGarcía, Héctor
dc.contributor.authorVinuesa, Guillermo
dc.contributor.authorGonzález, Mireia B.
dc.contributor.authorCampabadal, Francesca
dc.contributor.authorCastán, Helena
dc.contributor.authorDueñas, Salvador
dc.date.accessioned2026-02-04T09:39:28Z
dc.date.available2026-02-04T09:39:28Z
dc.date.issued2025
dc.identifier.citationMaterials Science in Semiconductor Processing, 2025, 186,109037es
dc.identifier.issn1369-8001es
dc.identifier.urihttps://uvadoc.uva.es/handle/10324/82540
dc.descriptionProducción Científicaes
dc.description.abstractMemristors, also known as resistive switching devices, have great potential for applications in memory and neuromorphic systems. Understanding the switching mechanisms is crucial since ReRAM memories need to operate at high frequencies. It is known the reset transition is dominated by the conductive filament Joule heating. We have studied the reset transition in TiN/Ti/HfO2/W metal–insulator–metal memristors by applying constant power signals to different initial filament thicknesses, which were obtained using different initial low resistance states. The results show that power value controls the reset times, decreasing when the power is increased. On the other hand, larger resistances lead to faster reset transitions. These measurements have allowed us to obtain a value of the thermal resistance of the conductive filament. Moreover, we have observed the reset times as a function of the initial resistance and the power lies on a common plane, which allows us to estimate the transition time by fixing an initial resistance and a power value.es
dc.format.mimetypeapplication/pdfes
dc.language.isospaes
dc.rights.accessRightsinfo:eu-repo/semantics/embargoedAccesses
dc.titleReset transition in HfO2-Based memristors using a constant power signales
dc.typeinfo:eu-repo/semantics/articlees
dc.rights.holderElsevieres
dc.identifier.doi10.1016/j.mssp.2024.109037es
dc.relation.publisherversionhttps://www.sciencedirect.com/science/article/pii/S1369800124009338#abs0010es
dc.identifier.publicationfirstpage109037es
dc.identifier.publicationtitleMaterials Science in Semiconductor Processinges
dc.identifier.publicationvolume186es
dc.peerreviewedSIes
dc.description.projectPID2022-139586NB-C43 funded by MCIN/AEI/10.13039/501100011033 and by FEDER “A way of making Europe”es
dc.description.projectPID2022-139586NB-C42 funded by MCIN/AEI/10.13039/501100011033 and by ERDF “A way of making Europe”es
dc.description.projectCSIC funding through project 20225AT012es
dc.description.projectGeneralitat de Catalunya - AGAUR project 2021 SGR 00497es
dc.description.projectProject CR32023040125, funded by MICIU/AEI/10.13039/ 501100011033 and by the NextGeneration EU/PRTR programes
dc.type.hasVersioninfo:eu-repo/semantics/acceptedVersiones


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