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Título
Impact of the temperature on the conductive filament morphology in HfO2-based RRAM
Autor
Año del Documento
2024
Editorial
Elsevier
Descripción
Producción Científica
Documento Fuente
Materials Letters, 2024, vol. 357, 135699
Abstract
In this letter, we study the impact of the temperature on the resistive switching effect of TiN/Ti/HfO2/W metal–insulator-metal devices. An analysis of the conduction mechanisms is made, with the low resistance state being ruled by nearest neighbor hopping, while the conduction in the high resistance state is dominated by Schottky emission. Taking into account the filamentary mechanism behind the resistive switching effect, a thorough analysis of the Schottky emission allows for the calculation of the gap between conductive filament tip and metal electrode in the high resistance state. We report an increase of this gap when temperature lowers below a certain value. Moreover, the mentioned gap adopts values of integer multiples of the the mean distance between traps obtained by the hopping model.
Materias (normalizadas)
Electrical engineering
Materias Unesco
2202.03 Electricidad
Palabras Clave
Conductive filament
Resistive switching
Temperature dependence
Filamento conductor
Conmutación resistiva
Dependencia de temperatura
ISSN
0167-577X
Revisión por pares
SI
Patrocinador
Ministerio de Ciencia e Innovación (PID2022-139586NB-C42 y PID2022-139586NB-C43)
Consejo Superior de Investigaciones Científicas (2022AT012)
Ramón y Cajal grant No. RYC2020-030150-I
Consejo Superior de Investigaciones Científicas (2022AT012)
Ramón y Cajal grant No. RYC2020-030150-I
Propietario de los Derechos
© 2024 The Authors
Idioma
eng
Tipo de versión
info:eu-repo/semantics/publishedVersion
Derechos
openAccess
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