The effective dopant concentration in p-type Si detectors reduces with irradiation fluence at low fluences due to the acceptor removal process, which degrades detector performance and shortens its lifetime. This effect has been experimentally characterized and parametrized, but its microscopic origin is still unknown. We use atomistic simulations to gain insight into acceptor removal in neutron irradiation by modeling damage generation and defect-dopant interactions. We analyze the effect on dopant deactivation of the Si di- and tri-interstitial diffusion, the inhomogeneity of irradiation damage and the wafer temperature rise during irradiation. We characterize defect generation rates and identify the relevant defect-dopant interactions. Acceptor removal occurs mainly through the formation of Bi pairs and small boron-interstitial clusters, and it is limited by the availability of mobile Si interstitials. The presence of impurities (O, C) modifies B-complexes favoring the formation of BiO, but has a limited effect on the amount of removed acceptors.
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