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Título
IONDegradation in Si Devices in Harsh Radiation Environments: Modeling of Damage-Dopant Interactions
Autor
Congreso
2018 Spanish Conference on Electron Devices (CDE)
Año del Documento
2019
Editorial
Institute of Electrical and Electronics Engineers (IEEE).
Descripción
Producción Científica
Documento Fuente
2018 Spanish Conference on Electron Devices (CDE). Proceedings, 14-16 Nov. 2018, Salamanca.
Resumen
Electronic devices operating in harsh radiation environments must withstand high radiation levels with minimal performance degradation. Recent experiments on the radiation hardness of a new vertical p-type JFET power switch have shown a significant reduction of forward drain current under non-ionizing conditions. In this work, atomistic simulations are used to study the impact of irradiation-induced displacement damage on forward characteristics. Damage models have been updated to produce a better description of damage-dopant interactions at RT. Our results show that excess self-interstitials produced by irradiation deactivate a significant amount of B atoms, thus reducing the effective dopant concentration.
Palabras Clave
Degradación de la corriente
Current degradation
Silicio
Silicon
ISBN
978-1-5386-5779-9
Patrocinador
Ministerio de Ciencia e Innovación (Project TEC2014-60694-P)
Junta de Castilla y León (programa de apoyo a proyectos de investigación - Ref. VA119G18)
Junta de Castilla y León (programa de apoyo a proyectos de investigación - Ref. VA119G18)
Version del Editor
Propietario de los Derechos
© 2019 IEEE
Idioma
eng
Derechos
openAccess
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